Semiconductor Wafer Polisher Head Assembly from Mexico
Complete polishing head with carrier film, retaining ring, and drive shaft for single/dual wafer polishers. Applies 2-7 psi pressure for planarization. Major replacement part for wafer polishers in 8442.40.00.00.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document removal rate specs (0.5-2.0 μm/min) and compatible pad types
• Complete head vs consumable pieces (retainer ring only) affects duty treatment
• Edge bead removal capability must be specified for advanced wafer classification