Camtek Eagle i 3D Wafer Metrology System
Advanced packaging 3D metrology tool combining optical profilometry and color interferometry for micro-bump inspection on semiconductor wafers. Critical for heterogeneous integration processes. HTS 9031.41.00 as wafer inspection equipment.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If general 3D optical profilometers
If not documented specifically for semiconductor wafer bumps
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Import Tips & Compliance
• Advanced packaging certification distinguishes from general 3D profilometers
• White light interferometry specs support optical classification
• Israeli export licensing frequently applies to metrology tools
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