Camtek Eagle i 3D Wafer Metrology System from Mexico
Advanced packaging 3D metrology tool combining optical profilometry and color interferometry for micro-bump inspection on semiconductor wafers. Critical for heterogeneous integration processes. HTS 9031.41.00 as wafer inspection equipment.
Duty Rate — Mexico → United States
0%
Rate breakdown
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Advanced packaging certification distinguishes from general 3D profilometers
• White light interferometry specs support optical classification
• Israeli export licensing frequently applies to metrology tools