For wafers
Measuring or checking instruments, appliances and machines, not specified or included elsewhere in this chapter; profile projectors; parts and accessories thereof: > Other optical instruments and appliances: > For inspecting semiconductor wafers or devices (including integrated circuits) or for inspecting photomasks or reticles used in manufacturing semiconductor devices (including integrated circuits) > For inspecting semiconductor wafers or devices: > For wafers
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 9031.41.00.40
Automated Wafer Particle Counter
Dark-field optical microscope system automatically counting and sizing contamination particles on unpatterned semiconductor wafers. Critical for yield optimization in wafer fabrication cleanrooms. HTS 9031.41.00.40 covers this specialized optical wafer inspection equipment.
Wafer Bow/Warp Optical Analyzer
Laser reflection optical system measuring wafer bow, warp, and total thickness variation across 300mm semiconductor wafers. Critical for stress analysis post-deposition processes. Classified under HTS 9031.41.00.40 as specialized wafer inspection optics.
Phase Shift Wafer Inspection System
Coherence scanning interferometry system using phase shifting for wafer surface characterization at angstrom-level precision. Detects subtle thickness variations invisible to standard optics. HTS 9031.41.00.40 for advanced optical wafer inspection technology.
Oblique Illumination Wafer Inspector
Specialized optical system using oblique angle illumination to enhance topographic defect visibility on patterned semiconductor wafers. Ideal for detecting shallow pits and mounds. Classified HTS 9031.41.00.40 for wafer optical inspection optimization.
Multi-Wavelength Wafer Metrology Tool
Broadband spectrophotometry optical system measuring thin film stack thicknesses across entire semiconductor wafers. Essential for process control in advanced nodes. HTS 9031.41.00.40 covers this wafer-specific optical measuring instrument.
Wafer Patterned Film Inspector
Ellipso-polarimetric optical system for patterned wafer thin film stress and thickness uniformity inspection. Uses multiple angles of incidence for complete characterization. HTS 9031.41.00.40 for advanced semiconductor wafer optics.
Laser Doppler Wafer Vibrometer
Non-contact laser Doppler vibrometry system measuring wafer vibration modes and chucking stability during processing. Critical for overlay improvement. Borderline HTS 9031.41.00.40 for wafer optical inspection applications.
Structured Light Wafer Scanner
Fringe projection structured light optical system for full-field 3D wafer shape measurement. Detects subtle global distortions affecting lithography overlay. HTS 9031.41.00.40 classification for specialized wafer inspection optics.
Wafer Surface Defect Scanner
An optical inspection system designed specifically for detecting microscopic defects on semiconductor wafers during manufacturing. It uses laser scanning and high-resolution imaging to identify particles, scratches, and pattern anomalies on bare silicon wafers. Classified under HTS 9031.41.00.40 as an optical instrument for inspecting semiconductor wafers.
Laser Wafer Overlay Metrology Tool
Precision optical instrument measuring overlay alignment between multiple lithographic layers on semiconductor wafers. Employs interferometry and pattern recognition to ensure nanometer-level accuracy in wafer patterning processes. Falls under HTS 9031.41.00.40 for wafer-specific optical inspection in IC production.
Wafer Flatness Profiler
Non-contact optical profiler using white light interferometry to measure wafer thickness variation and surface flatness. Essential for ensuring silicon wafer planarity before lithographic processing. Specifically classified in HTS 9031.41.00.40 for semiconductor wafer optical inspection.
UV Wafer Edge Inspection System
Ultraviolet optical imaging system for detecting micro-cracks, chipping, and contamination along semiconductor wafer edges. Prevents handling defects during robotic transfer in fabs. HTS 9031.41.00.40 applies to this wafer-focused optical inspection technology.
Darkfield Wafer Inspection Microscope
High NA darkfield optical microscope optimized for detecting sub-micron particles on polished semiconductor wafers. Features automated stage and pattern recognition software. HTS 9031.41.00.40 designation for wafer-specific optical inspection systems.
Confocal Wafer Surface Profiler
Confocal laser scanning optical profiler measuring 3D topography of semiconductor wafer surfaces at nanometer resolution. Used for characterizing CMP process uniformity. Falls under HTS 9031.41.00.40 for specialized wafer optical inspection.
Wafer Critical Dimension SEM
Scanning electron microscope with optical pre-alignment for measuring critical dimensions on semiconductor wafers post-lithography. Though primarily electron beam, includes essential optical wafer handling and positioning. Borderline HTS 9031.41.00.40 for wafer optical components.