Structured Light Wafer Scanner

Fringe projection structured light optical system for full-field 3D wafer shape measurement. Detects subtle global distortions affecting lithography overlay. HTS 9031.41.00.40 classification for specialized wafer inspection optics.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳ChinaFree+35.0%35%
🇲🇽MexicoFree+10.0%10%
🇨🇦CanadaFree+10.0%10%
🇩🇪GermanyFree+10.0%10%
🇯🇵JapanFree+10.0%10%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

9013.80Lower: 14.5% vs 35%

If general structured light 3D scanners

Industry-specific application determines Chapter 90 subheading.

9031.49.40.00Same rate: 35%

If other optical 3D measurement systems

Measurement target specificity affects classification granularity.

8479.89Lower: 12.5% vs 35%

If industrial 3D inspection machines for multiple uses

Loss of dedicated wafer inspection functionality.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

Fringe pattern resolution and projector wavelength specifications needed

Distinguish from general 3D scanners via semiconductor flatness standards

Software metrology algorithms may require separate IT classification

Related Products under HTS 9031.41.00.40

Automated Wafer Particle Counter

Dark-field optical microscope system automatically counting and sizing contamination particles on unpatterned semiconductor wafers. Critical for yield optimization in wafer fabrication cleanrooms. HTS 9031.41.00.40 covers this specialized optical wafer inspection equipment.

Wafer Bow/Warp Optical Analyzer

Laser reflection optical system measuring wafer bow, warp, and total thickness variation across 300mm semiconductor wafers. Critical for stress analysis post-deposition processes. Classified under HTS 9031.41.00.40 as specialized wafer inspection optics.

Phase Shift Wafer Inspection System

Coherence scanning interferometry system using phase shifting for wafer surface characterization at angstrom-level precision. Detects subtle thickness variations invisible to standard optics. HTS 9031.41.00.40 for advanced optical wafer inspection technology.

Oblique Illumination Wafer Inspector

Specialized optical system using oblique angle illumination to enhance topographic defect visibility on patterned semiconductor wafers. Ideal for detecting shallow pits and mounds. Classified HTS 9031.41.00.40 for wafer optical inspection optimization.

Multi-Wavelength Wafer Metrology Tool

Broadband spectrophotometry optical system measuring thin film stack thicknesses across entire semiconductor wafers. Essential for process control in advanced nodes. HTS 9031.41.00.40 covers this wafer-specific optical measuring instrument.

Wafer Patterned Film Inspector

Ellipso-polarimetric optical system for patterned wafer thin film stress and thickness uniformity inspection. Uses multiple angles of incidence for complete characterization. HTS 9031.41.00.40 for advanced semiconductor wafer optics.