Multi-Wavelength Wafer Metrology Tool

Broadband spectrophotometry optical system measuring thin film stack thicknesses across entire semiconductor wafers. Essential for process control in advanced nodes. HTS 9031.41.00.40 covers this wafer-specific optical measuring instrument.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳ChinaFree+35.0%35%
🇲🇽MexicoFree+10.0%10%
🇨🇦CanadaFree+10.0%10%
🇩🇪GermanyFree+10.0%10%
🇯🇵JapanFree+10.0%10%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

9027.50.40Same rate: 35%

If primarily ellipsometers or reflectometers

Spectroscopic instruments have separate analytical chemistry headings.

9013.80Lower: 14.5% vs 35%

If general optical measuring appliances

Semiconductor specificity determines subheading placement.

9031.80.80Same rate: 35%

If non-spectroscopic optical thickness measurement

Measurement principle affects optical instrument sub-classification.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

Spectral range (UV-Vis-NIR) and spot size specifications mandatory

Distinguish from wafer mappers by emphasizing spectroscopic capability

Ellipsometry functionality may trigger 9027 classification review

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Dark-field optical microscope system automatically counting and sizing contamination particles on unpatterned semiconductor wafers. Critical for yield optimization in wafer fabrication cleanrooms. HTS 9031.41.00.40 covers this specialized optical wafer inspection equipment.

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Laser reflection optical system measuring wafer bow, warp, and total thickness variation across 300mm semiconductor wafers. Critical for stress analysis post-deposition processes. Classified under HTS 9031.41.00.40 as specialized wafer inspection optics.

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Wafer Patterned Film Inspector

Ellipso-polarimetric optical system for patterned wafer thin film stress and thickness uniformity inspection. Uses multiple angles of incidence for complete characterization. HTS 9031.41.00.40 for advanced semiconductor wafer optics.

Laser Doppler Wafer Vibrometer

Non-contact laser Doppler vibrometry system measuring wafer vibration modes and chucking stability during processing. Critical for overlay improvement. Borderline HTS 9031.41.00.40 for wafer optical inspection applications.