Multi-Wavelength Wafer Metrology Tool from China
Broadband spectrophotometry optical system measuring thin film stack thicknesses across entire semiconductor wafers. Essential for process control in advanced nodes. HTS 9031.41.00.40 covers this wafer-specific optical measuring instrument.
Duty Rate — China → United States
25%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Spectral range (UV-Vis-NIR) and spot size specifications mandatory
• Distinguish from wafer mappers by emphasizing spectroscopic capability
• Ellipsometry functionality may trigger 9027 classification review