Vacuum Arc Reflow Oven for Solder Paste on PCBs
Specialized reflow oven using vacuum arc technology to precisely heat-treat solder paste on assembled printed circuits without oxidation. Exclusively for the final assembly stage in PCB production, qualifying under HTS 8514.32.10.00 for vacuum arc furnaces.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If standard infrared reflow without vacuum/arc features
Conventional soldering ovens without specialized plasma/arc classify under resistance heating apparatus.
If integrated into automated surface-mount assembly lines
Part of complete semiconductor assembly machines takes machine classification.
If for baking PCB photoresists in bulk industrial furnaces
General bakery ovens or bulk heating shift to industrial furnaces in Chapter 84.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Include thermal profile data showing arc-based heating optimized for PCB solder joints
• Avoid general reflow classification (8515.19) by emphasizing vacuum arc specificity
Related Products under HTS 8514.32.10.00
Dielectric Heating Plasma Cleaner for Circuit Boards
This plasma cleaner employs dielectric loss heating to activate gases for surface cleaning of bare printed circuit boards prior to component assembly. Designed exclusively for the heat treatment step in PCB manufacturing, it fits HTS 8514.32.10.00 criteria for specialized industrial equipment.
Dielectric Barrier Discharge Plasma Generator for PCB Surface Activation
Atmospheric pressure plasma generator using dielectric barrier discharge for activating PCB surfaces to improve adhesion before lamination. Principally for printed circuit production lines, covered by HTS 8514.32.10.00 plasma heat treatment equipment.
Sputtering Target Vacuum Arc Source for PCB Metallization
Vacuum arc source that deposits thin metal films onto printed circuit substrates via arc evaporation in sputtering systems. Exclusively engineered for PCB metallization processes, fitting HTS 8514.32.10.00 vacuum arc furnace specifications.
Plasma Etching Chamber for PCB Manufacturing
This plasma etching chamber generates low-pressure plasma using dielectric loss to precisely remove material layers from printed circuit boards during fabrication. It is designed solely for semiconductor and PCB manufacturing environments, meeting the criteria for HTS 8514.32.10.00 as equipment for heat treatment by dielectric loss used principally in printed circuit assembly production.
Vacuum Arc Melting Furnace for PCB Substrate Alloying
A specialized vacuum arc furnace that melts and refines metal alloys used in printed circuit substrates through arc heat treatment under vacuum. Tailored exclusively for the printed circuit manufacturing process, it qualifies under HTS 8514.32.10.00 for vacuum arc furnaces principally used in PCB assembly.
Induction Plasma Torch for Printed Circuit Etching
Compact induction plasma torch system that generates high-temperature plasma for selective etching of copper layers on printed circuits. Principally engineered for PCB fabrication lines, aligning with HTS 8514.32.10.00 for induction heat treatment equipment in circuit manufacturing.