Vacuum Arc Reflow Oven for Solder Paste on PCBs from Japan
Specialized reflow oven using vacuum arc technology to precisely heat-treat solder paste on assembled printed circuits without oxidation. Exclusively for the final assembly stage in PCB production, qualifying under HTS 8514.32.10.00 for vacuum arc furnaces.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Include thermal profile data showing arc-based heating optimized for PCB solder joints
• Avoid general reflow classification (8515.19) by emphasizing vacuum arc specificity