Of a kind used solely or principally for the manufacture of printed circuits or printed circuit assemblies
Industrial or laboratory electric furnaces and ovens (including those functioning by induction or dielectric loss); other industrial or laboratory equipment for the heat treatment of materials by induction or dielectric loss; parts thereof: > Other furnaces and ovens: > Plasma and vacuum arc furnaces: > Of a kind used solely or principally for the manufacture of printed circuits or printed circuit assemblies
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8514.32.10.00
Dielectric Heating Plasma Cleaner for Circuit Boards
This plasma cleaner employs dielectric loss heating to activate gases for surface cleaning of bare printed circuit boards prior to component assembly. Designed exclusively for the heat treatment step in PCB manufacturing, it fits HTS 8514.32.10.00 criteria for specialized industrial equipment.
Dielectric Barrier Discharge Plasma Generator for PCB Surface Activation
Atmospheric pressure plasma generator using dielectric barrier discharge for activating PCB surfaces to improve adhesion before lamination. Principally for printed circuit production lines, covered by HTS 8514.32.10.00 plasma heat treatment equipment.
Sputtering Target Vacuum Arc Source for PCB Metallization
Vacuum arc source that deposits thin metal films onto printed circuit substrates via arc evaporation in sputtering systems. Exclusively engineered for PCB metallization processes, fitting HTS 8514.32.10.00 vacuum arc furnace specifications.
Plasma Etching Chamber for PCB Manufacturing
This plasma etching chamber generates low-pressure plasma using dielectric loss to precisely remove material layers from printed circuit boards during fabrication. It is designed solely for semiconductor and PCB manufacturing environments, meeting the criteria for HTS 8514.32.10.00 as equipment for heat treatment by dielectric loss used principally in printed circuit assembly production.
Vacuum Arc Melting Furnace for PCB Substrate Alloying
A specialized vacuum arc furnace that melts and refines metal alloys used in printed circuit substrates through arc heat treatment under vacuum. Tailored exclusively for the printed circuit manufacturing process, it qualifies under HTS 8514.32.10.00 for vacuum arc furnaces principally used in PCB assembly.
Induction Plasma Torch for Printed Circuit Etching
Compact induction plasma torch system that generates high-temperature plasma for selective etching of copper layers on printed circuits. Principally engineered for PCB fabrication lines, aligning with HTS 8514.32.10.00 for induction heat treatment equipment in circuit manufacturing.
Vacuum Arc Reflow Oven for Solder Paste on PCBs
Specialized reflow oven using vacuum arc technology to precisely heat-treat solder paste on assembled printed circuits without oxidation. Exclusively for the final assembly stage in PCB production, qualifying under HTS 8514.32.10.00 for vacuum arc furnaces.
RF Plasma Asher for Photoresist Removal in PCB Fab
RF-powered plasma asher that uses dielectric loss to ash away photoresist materials from printed circuit boards after patterning. Designed solely for semiconductor and PCB fabrication cleanrooms, it meets HTS 8514.32.10.00 for plasma equipment in circuit assembly.