RF Plasma Asher for Photoresist Removal in PCB Fab
RF-powered plasma asher that uses dielectric loss to ash away photoresist materials from printed circuit boards after patterning. Designed solely for semiconductor and PCB fabrication cleanrooms, it meets HTS 8514.32.10.00 for plasma equipment in circuit assembly.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If laboratory-scale for photoresist testing
Lab physicochemical analysis tools without industrial capacity shift to Chapter 90.
If imported as subassemblies for on-site furnace construction
Electrical machine parts classified separately from complete ovens.
If medical sterilization versions adapted for cleanroom use
Sterilization equipment using heat/chemicals goes to medical appliances.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Submit RF frequency specs and chamber volume data confirming PCB panel sizing
• Use ISO cleanroom certifications to validate industrial manufacturing intent
Related Products under HTS 8514.32.10.00
Dielectric Heating Plasma Cleaner for Circuit Boards
This plasma cleaner employs dielectric loss heating to activate gases for surface cleaning of bare printed circuit boards prior to component assembly. Designed exclusively for the heat treatment step in PCB manufacturing, it fits HTS 8514.32.10.00 criteria for specialized industrial equipment.
Dielectric Barrier Discharge Plasma Generator for PCB Surface Activation
Atmospheric pressure plasma generator using dielectric barrier discharge for activating PCB surfaces to improve adhesion before lamination. Principally for printed circuit production lines, covered by HTS 8514.32.10.00 plasma heat treatment equipment.
Sputtering Target Vacuum Arc Source for PCB Metallization
Vacuum arc source that deposits thin metal films onto printed circuit substrates via arc evaporation in sputtering systems. Exclusively engineered for PCB metallization processes, fitting HTS 8514.32.10.00 vacuum arc furnace specifications.
Plasma Etching Chamber for PCB Manufacturing
This plasma etching chamber generates low-pressure plasma using dielectric loss to precisely remove material layers from printed circuit boards during fabrication. It is designed solely for semiconductor and PCB manufacturing environments, meeting the criteria for HTS 8514.32.10.00 as equipment for heat treatment by dielectric loss used principally in printed circuit assembly production.
Vacuum Arc Melting Furnace for PCB Substrate Alloying
A specialized vacuum arc furnace that melts and refines metal alloys used in printed circuit substrates through arc heat treatment under vacuum. Tailored exclusively for the printed circuit manufacturing process, it qualifies under HTS 8514.32.10.00 for vacuum arc furnaces principally used in PCB assembly.
Induction Plasma Torch for Printed Circuit Etching
Compact induction plasma torch system that generates high-temperature plasma for selective etching of copper layers on printed circuits. Principally engineered for PCB fabrication lines, aligning with HTS 8514.32.10.00 for induction heat treatment equipment in circuit manufacturing.