Sputtering Target Vacuum Arc Source for PCB Metallization
Vacuum arc source that deposits thin metal films onto printed circuit substrates via arc evaporation in sputtering systems. Exclusively engineered for PCB metallization processes, fitting HTS 8514.32.10.00 vacuum arc furnace specifications.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If full PVD coating machines for semiconductor wafers
Complete semiconductor processing machines encompass arc sources.
If imported sputtering targets without arc generation capability
Base metal sputtering targets without furnace function are metals NESOI.
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Import Tips & Compliance
• Classify as complete arc source with chamber, not mere target material (8112)
• Provide deposition rate data tied to PCB copper/nickel layers
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