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8514.32.10.00/Sputtering Target Vacuum Arc Source for PCB Metallization/Mexico

Sputtering Target Vacuum Arc Source for PCB Metallization from Mexico

Vacuum arc source that deposits thin metal films onto printed circuit substrates via arc evaporation in sputtering systems. Exclusively engineered for PCB metallization processes, fitting HTS 8514.32.10.00 vacuum arc furnace specifications.

Duty Rate — Mexico → United States

10%

Rate breakdown

9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
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Import Tips

• Classify as complete arc source with chamber, not mere target material (8112)

• Provide deposition rate data tied to PCB copper/nickel layers

Sputtering Target Vacuum Arc Source for PCB Metallization from Mexico — Import Duty Rate | HTS 8514.32.10.00