Sputtering Target Vacuum Arc Source for PCB Metallization from Mexico
Vacuum arc source that deposits thin metal films onto printed circuit substrates via arc evaporation in sputtering systems. Exclusively engineered for PCB metallization processes, fitting HTS 8514.32.10.00 vacuum arc furnace specifications.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Classify as complete arc source with chamber, not mere target material (8112)
• Provide deposition rate data tied to PCB copper/nickel layers