Vacuum Arc Reflow Oven for Solder Paste on PCBs from Mexico
Specialized reflow oven using vacuum arc technology to precisely heat-treat solder paste on assembled printed circuits without oxidation. Exclusively for the final assembly stage in PCB production, qualifying under HTS 8514.32.10.00 for vacuum arc furnaces.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include thermal profile data showing arc-based heating optimized for PCB solder joints
• Avoid general reflow classification (8515.19) by emphasizing vacuum arc specificity