Vacuum Arc Reflow Oven for Solder Paste on PCBs from Canada
Specialized reflow oven using vacuum arc technology to precisely heat-treat solder paste on assembled printed circuits without oxidation. Exclusively for the final assembly stage in PCB production, qualifying under HTS 8514.32.10.00 for vacuum arc furnaces.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Include thermal profile data showing arc-based heating optimized for PCB solder joints
• Avoid general reflow classification (8515.19) by emphasizing vacuum arc specificity