Vacuum Arc Reflow Oven for Solder Paste on PCBs from Germany
Specialized reflow oven using vacuum arc technology to precisely heat-treat solder paste on assembled printed circuits without oxidation. Exclusively for the final assembly stage in PCB production, qualifying under HTS 8514.32.10.00 for vacuum arc furnaces.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Include thermal profile data showing arc-based heating optimized for PCB solder joints
• Avoid general reflow classification (8515.19) by emphasizing vacuum arc specificity