Miniature Deep Groove Ball Bearing
Miniature deep groove ball bearing for wafer slicing saw spindles in semiconductor wafer preparation equipment, offering low friction for ultra-thin kerf cuts. Classified under HTS 8482.10.50 as other ball bearings. Essential for precise slicing of monocrystalline semiconductor boules into wafers.
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More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If capable of accommodating combined radial and axial loads
Thrust ball bearings or those with thrust capability classify separately from pure radial deep groove types.
If imported as replacement part for wafer slicing machines
Parts of semiconductor processing machines like slicing saws may qualify under dedicated HTS provisions.
If for industrial semiconductor testing equipment
Certain bearing parts for testing semiconductor devices fall under statistical notes for Chapter 90 equipment.
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Import Tips & Compliance
• Document end-use in semiconductor wafer prep to support classification; include equipment blueprints
• Watch for anti-dumping duties on miniature bearings from certain origins
• Pitfall: incorrect size reporting leading to thrust bearing misclassification
Related Products under HTS 8482.10.50
Precision Angular Contact Ball Bearing
A high-precision angular contact ball bearing designed for high-speed semiconductor wafer grinding machines, capable of handling both radial and axial loads. It falls under HTS 8482.10.50 as an other ball bearing not specified elsewhere in the ball bearings subheading. Used in crystal grinders to maintain exact tolerances during boule grinding.
Ceramic Hybrid Ball Bearing
Ceramic hybrid ball bearing with steel races and ceramic balls for wafer polishers in semiconductor fabrication prep, providing superior wear resistance and minimal particle generation. Falls under HTS 8482.10.50 as other ball bearings. Critical for achieving flatness tolerances on wafer surfaces.
High-Speed Spindle Ball Bearing
ABEC-9 precision ball bearing for high RPM spindles in float zone crystal pullers for semiconductor boule production. Classified HTS 8482.10.50 as other ball bearings due to specialized tolerances. Enables stable rotation during monocrystalline silicon growth.
Flanged Miniature Ball Bearing
Stainless steel flanged miniature ball bearing for mounting wafer lapping equipment in semiconductor processing lines. HTS 8482.10.50 as other ball bearing despite flange feature not matching prior specifics. Ensures precise alignment during wafer surface preparation.
Duplex Matched Ball Bearing Set
Pre-matched duplex angular contact ball bearings for crystal boule grinders in semiconductor wafer manufacturing, providing rigid preload. Classifies under HTS 8482.10.50 as other ball bearings. Used to grind precise diameters and flats indicating crystal properties.