Duplex Matched Ball Bearing Set
Pre-matched duplex angular contact ball bearings for crystal boule grinders in semiconductor wafer manufacturing, providing rigid preload. Classifies under HTS 8482.10.50 as other ball bearings. Used to grind precise diameters and flats indicating crystal properties.
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More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If sold as assembled matched pair rather than individual
Matched bearing sets assembled for specific preload classify as spherical roller bearing heading? No—duplex angular contact typically remains ball bearings but watch set provisions.
If imported as semiconductor equipment spare parts kit
Bearing sets for semiconductor testing apparatus may have statistical provisions.
If integral to precision grinding measurement systems
Combined grinding/measurement apparatus for semiconductors takes Chapter 90 precedence.
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Import Tips & Compliance
• Certify matched pair tolerances; critical for avoiding separate parts classification
• Document semiconductor end-use to support rate
• Common error: declaring as single bearings instead of set
Related Products under HTS 8482.10.50
Precision Angular Contact Ball Bearing
A high-precision angular contact ball bearing designed for high-speed semiconductor wafer grinding machines, capable of handling both radial and axial loads. It falls under HTS 8482.10.50 as an other ball bearing not specified elsewhere in the ball bearings subheading. Used in crystal grinders to maintain exact tolerances during boule grinding.
Miniature Deep Groove Ball Bearing
Miniature deep groove ball bearing for wafer slicing saw spindles in semiconductor wafer preparation equipment, offering low friction for ultra-thin kerf cuts. Classified under HTS 8482.10.50 as other ball bearings. Essential for precise slicing of monocrystalline semiconductor boules into wafers.
Ceramic Hybrid Ball Bearing
Ceramic hybrid ball bearing with steel races and ceramic balls for wafer polishers in semiconductor fabrication prep, providing superior wear resistance and minimal particle generation. Falls under HTS 8482.10.50 as other ball bearings. Critical for achieving flatness tolerances on wafer surfaces.
High-Speed Spindle Ball Bearing
ABEC-9 precision ball bearing for high RPM spindles in float zone crystal pullers for semiconductor boule production. Classified HTS 8482.10.50 as other ball bearings due to specialized tolerances. Enables stable rotation during monocrystalline silicon growth.
Flanged Miniature Ball Bearing
Stainless steel flanged miniature ball bearing for mounting wafer lapping equipment in semiconductor processing lines. HTS 8482.10.50 as other ball bearing despite flange feature not matching prior specifics. Ensures precise alignment during wafer surface preparation.