Precision Angular Contact Ball Bearing
A high-precision angular contact ball bearing designed for high-speed semiconductor wafer grinding machines, capable of handling both radial and axial loads. It falls under HTS 8482.10.50 as an other ball bearing not specified elsewhere in the ball bearings subheading. Used in crystal grinders to maintain exact tolerances during boule grinding.
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More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If imported as a distinct part of a bearing assembly
Bearing parts like races or balls separate from complete bearings classify under balls or roller bearing parts.
If for testing apparatus in semiconductor device inspection
Precision bearings integral to measuring/testing machines for semiconductor devices may shift to Chapter 90.
If designed exclusively for semiconductor manufacturing machines
Machines for semiconductor production and parts thereof have dedicated provisions outside general bearings.
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Import Tips & Compliance
• Verify bearing specifications match semiconductor equipment use for accurate classification; provide manufacturer datasheets showing precision tolerances
• Ensure origin certificates as duties vary by country
• Common pitfall: misclassifying as general machinery parts under 8482.90
Related Products under HTS 8482.10.50
Miniature Deep Groove Ball Bearing
Miniature deep groove ball bearing for wafer slicing saw spindles in semiconductor wafer preparation equipment, offering low friction for ultra-thin kerf cuts. Classified under HTS 8482.10.50 as other ball bearings. Essential for precise slicing of monocrystalline semiconductor boules into wafers.
Ceramic Hybrid Ball Bearing
Ceramic hybrid ball bearing with steel races and ceramic balls for wafer polishers in semiconductor fabrication prep, providing superior wear resistance and minimal particle generation. Falls under HTS 8482.10.50 as other ball bearings. Critical for achieving flatness tolerances on wafer surfaces.
High-Speed Spindle Ball Bearing
ABEC-9 precision ball bearing for high RPM spindles in float zone crystal pullers for semiconductor boule production. Classified HTS 8482.10.50 as other ball bearings due to specialized tolerances. Enables stable rotation during monocrystalline silicon growth.
Flanged Miniature Ball Bearing
Stainless steel flanged miniature ball bearing for mounting wafer lapping equipment in semiconductor processing lines. HTS 8482.10.50 as other ball bearing despite flange feature not matching prior specifics. Ensures precise alignment during wafer surface preparation.
Duplex Matched Ball Bearing Set
Pre-matched duplex angular contact ball bearings for crystal boule grinders in semiconductor wafer manufacturing, providing rigid preload. Classifies under HTS 8482.10.50 as other ball bearings. Used to grind precise diameters and flats indicating crystal properties.