Precision Angular Contact Ball Bearing from Japan
A high-precision angular contact ball bearing designed for high-speed semiconductor wafer grinding machines, capable of handling both radial and axial loads. It falls under HTS 8482.10.50 as an other ball bearing not specified elsewhere in the ball bearings subheading. Used in crystal grinders to maintain exact tolerances during boule grinding.
Duty Rate — Japan → United States
19%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Verify bearing specifications match semiconductor equipment use for accurate classification; provide manufacturer datasheets showing precision tolerances
• Ensure origin certificates as duties vary by country
• Common pitfall: misclassifying as general machinery parts under 8482.90