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Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8482.10.50.68
Precision Angular Contact Ball Bearing
A high-precision angular contact ball bearing designed for high-speed semiconductor wafer grinding machines, capable of handling both radial and axial loads. It falls under HTS 8482.10.5068 as a specialized ball bearing not classified elsewhere in the ball bearings subheading, commonly used in equipment like wafer grinders and polishers for maintaining flatness tolerances. These bearings ensure minimal vibration and precise rotation essential for semiconductor processing.
Miniature Deep Groove Ball Bearing
Miniature deep groove ball bearings optimized for crystal grinders in semiconductor boule preparation, featuring low friction and high stiffness for diameter precision. Classified under HTS 8482.10.5068 as other ball bearings, these support the grinding of crystal ingots to exact specifications before wafer slicing. They are critical for maintaining conductivity-indicating flats on semiconductor crystals.
High-Speed Ceramic Hybrid Ball Bearing
Ceramic hybrid ball bearings with steel races and ceramic balls for float zone crystal pullers in semiconductor wafer manufacturing, offering extreme purity and heat resistance. Under HTS 8482.10.5068 as other ball bearings, they enable contamination-free rotation during monocrystalline boule growth via Czochralski methods. Essential for slicing ultra-flat wafers without defects.
Thin-Section Ball Bearing for Wafer Polishers
Thin-section ball bearings for wafer lappers and polishers, providing ultra-low profile support for surface flatness in semiconductor fabrication prep. Classified in HTS 8482.10.5068 as other ball bearings not fitting prior subcategories, critical for bringing wafers to dimensional tolerances before device processing. Enables the high-precision polishing required for monocrystalline silicon wafers.
Corrosion-Resistant Ball Bearing for Slicing Saws
Corrosion-resistant stainless steel ball bearings for wafer slicing saws that cut monocrystalline boules into thin wafers for semiconductor devices. HTS 8482.10.5068 covers these as other ball bearings, supporting diamond wire or blade saws in cleanroom environments. Ensures precise, defect-free wafer slices vital for gallium arsenide and silicon processing.
Vacuum-Compatible Ball Bearing for Crystal Growers
Ball bearings engineered for vacuum environments in Czochralski crystal growers, pulling pure silicon boules for semiconductor wafers. Under HTS 8482.10.5068 as other ball bearings, they withstand high temperatures and ultra-high vacuum without outgassing. Key for growing defect-free monocrystalline material before boule grinding and slicing.
Low-Vibration Ball Bearing for Wafer Indexers
Low-vibration precision ball bearings for wafer handling indexers in semiconductor preparation equipment, ensuring alignment during grinding and polishing. Classified HTS 8482.10.5068 for other ball bearings suited to nanoscale tolerances in silicon wafer fab. Minimizes particulate generation critical for cleanroom standards.