Miniature Deep Groove Ball Bearing

Miniature deep groove ball bearings optimized for crystal grinders in semiconductor boule preparation, featuring low friction and high stiffness for diameter precision. Classified under HTS 8482.10.5068 as other ball bearings, these support the grinding of crystal ingots to exact specifications before wafer slicing. They are critical for maintaining conductivity-indicating flats on semiconductor crystals.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳China9%+35.0%44%
🇲🇽Mexico9%+10.0%19%
🇨🇦Canada9%+10.0%19%
🇩🇪Germany9%+10.0%19%
🇯🇵Japan9%+10.0%19%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8482.10.10Higher: 52.4% vs 44%

If matching specific matched-set criteria for high-speed applications

Matched bearing sets for high-speed operations are separated in 8482.10.10, not general 'other'.

8483.50.90Lower: 37.8% vs 44%

If considered a plain shaft bearing rather than ball type

Slide bearings without rolling elements fall under 8483, based on design not semiconductor use.

8479.50.00Lower: 37.5% vs 44%

If imported as part of semiconductor wafer preparation machinery

Complete or sub-assemblies of semiconductor processing machines are in 8479.50, not individual components.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

Label with exact dimensions and ABEC precision rating to justify miniature/other classification

Include invoices specifying use in semiconductor crystal processing to prevent misclassification

Ensure RoHS compliance documentation for electronics-adjacent imports

Related Products under HTS 8482.10.50.68

Precision Angular Contact Ball Bearing

A high-precision angular contact ball bearing designed for high-speed semiconductor wafer grinding machines, capable of handling both radial and axial loads. It falls under HTS 8482.10.5068 as a specialized ball bearing not classified elsewhere in the ball bearings subheading, commonly used in equipment like wafer grinders and polishers for maintaining flatness tolerances. These bearings ensure minimal vibration and precise rotation essential for semiconductor processing.

High-Speed Ceramic Hybrid Ball Bearing

Ceramic hybrid ball bearings with steel races and ceramic balls for float zone crystal pullers in semiconductor wafer manufacturing, offering extreme purity and heat resistance. Under HTS 8482.10.5068 as other ball bearings, they enable contamination-free rotation during monocrystalline boule growth via Czochralski methods. Essential for slicing ultra-flat wafers without defects.

Thin-Section Ball Bearing for Wafer Polishers

Thin-section ball bearings for wafer lappers and polishers, providing ultra-low profile support for surface flatness in semiconductor fabrication prep. Classified in HTS 8482.10.5068 as other ball bearings not fitting prior subcategories, critical for bringing wafers to dimensional tolerances before device processing. Enables the high-precision polishing required for monocrystalline silicon wafers.

Corrosion-Resistant Ball Bearing for Slicing Saws

Corrosion-resistant stainless steel ball bearings for wafer slicing saws that cut monocrystalline boules into thin wafers for semiconductor devices. HTS 8482.10.5068 covers these as other ball bearings, supporting diamond wire or blade saws in cleanroom environments. Ensures precise, defect-free wafer slices vital for gallium arsenide and silicon processing.

Vacuum-Compatible Ball Bearing for Crystal Growers

Ball bearings engineered for vacuum environments in Czochralski crystal growers, pulling pure silicon boules for semiconductor wafers. Under HTS 8482.10.5068 as other ball bearings, they withstand high temperatures and ultra-high vacuum without outgassing. Key for growing defect-free monocrystalline material before boule grinding and slicing.

Low-Vibration Ball Bearing for Wafer Indexers

Low-vibration precision ball bearings for wafer handling indexers in semiconductor preparation equipment, ensuring alignment during grinding and polishing. Classified HTS 8482.10.5068 for other ball bearings suited to nanoscale tolerances in silicon wafer fab. Minimizes particulate generation critical for cleanroom standards.