Miniature Deep Groove Ball Bearing from Japan
Miniature deep groove ball bearings optimized for crystal grinders in semiconductor boule preparation, featuring low friction and high stiffness for diameter precision. Classified under HTS 8482.10.5068 as other ball bearings, these support the grinding of crystal ingots to exact specifications before wafer slicing. They are critical for maintaining conductivity-indicating flats on semiconductor crystals.
Duty Rate — Japan → United States
34%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Label with exact dimensions and ABEC precision rating to justify miniature/other classification
• Include invoices specifying use in semiconductor crystal processing to prevent misclassification
• Ensure RoHS compliance documentation for electronics-adjacent imports