Miniature Deep Groove Ball Bearing from Japan
Miniature deep groove ball bearings optimized for crystal grinders in semiconductor boule preparation, featuring low friction and high stiffness for diameter precision. Classified under HTS 8482.10.5068 as other ball bearings, these support the grinding of crystal ingots to exact specifications before wafer slicing. They are critical for maintaining conductivity-indicating flats on semiconductor crystals.
Duty Rate — Japan → United States
19%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Label with exact dimensions and ABEC precision rating to justify miniature/other classification
• Include invoices specifying use in semiconductor crystal processing to prevent misclassification
• Ensure RoHS compliance documentation for electronics-adjacent imports