Thin-Section Ball Bearing for Wafer Polishers
Thin-section ball bearings for wafer lappers and polishers, providing ultra-low profile support for surface flatness in semiconductor fabrication prep. Classified in HTS 8482.10.5068 as other ball bearings not fitting prior subcategories, critical for bringing wafers to dimensional tolerances before device processing. Enables the high-precision polishing required for monocrystalline silicon wafers.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If designed specifically as spherical roller bearings
Spherical roller types are distinctly classified under 8482.40, regardless of end-use.
If as assembled into complete wafer grinding apparatus
Other semiconductor manufacturing machines encompass integrated bearing assemblies.
If for industrial semiconductor testing machines
Machines for testing semiconductor devices may classify under 8486 if not Chapter 84/90 specific.
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Import Tips & Compliance
• Provide cross-sectional diagrams showing thin design to confirm 'other' status
• Document compatibility with CMP (chemical mechanical polishing) processes
• Avoid bulk packaging; use ESD-safe individual wraps for import inspection
Related Products under HTS 8482.10.50.68
Precision Angular Contact Ball Bearing
A high-precision angular contact ball bearing designed for high-speed semiconductor wafer grinding machines, capable of handling both radial and axial loads. It falls under HTS 8482.10.5068 as a specialized ball bearing not classified elsewhere in the ball bearings subheading, commonly used in equipment like wafer grinders and polishers for maintaining flatness tolerances. These bearings ensure minimal vibration and precise rotation essential for semiconductor processing.
Miniature Deep Groove Ball Bearing
Miniature deep groove ball bearings optimized for crystal grinders in semiconductor boule preparation, featuring low friction and high stiffness for diameter precision. Classified under HTS 8482.10.5068 as other ball bearings, these support the grinding of crystal ingots to exact specifications before wafer slicing. They are critical for maintaining conductivity-indicating flats on semiconductor crystals.
High-Speed Ceramic Hybrid Ball Bearing
Ceramic hybrid ball bearings with steel races and ceramic balls for float zone crystal pullers in semiconductor wafer manufacturing, offering extreme purity and heat resistance. Under HTS 8482.10.5068 as other ball bearings, they enable contamination-free rotation during monocrystalline boule growth via Czochralski methods. Essential for slicing ultra-flat wafers without defects.
Corrosion-Resistant Ball Bearing for Slicing Saws
Corrosion-resistant stainless steel ball bearings for wafer slicing saws that cut monocrystalline boules into thin wafers for semiconductor devices. HTS 8482.10.5068 covers these as other ball bearings, supporting diamond wire or blade saws in cleanroom environments. Ensures precise, defect-free wafer slices vital for gallium arsenide and silicon processing.
Vacuum-Compatible Ball Bearing for Crystal Growers
Ball bearings engineered for vacuum environments in Czochralski crystal growers, pulling pure silicon boules for semiconductor wafers. Under HTS 8482.10.5068 as other ball bearings, they withstand high temperatures and ultra-high vacuum without outgassing. Key for growing defect-free monocrystalline material before boule grinding and slicing.
Low-Vibration Ball Bearing for Wafer Indexers
Low-vibration precision ball bearings for wafer handling indexers in semiconductor preparation equipment, ensuring alignment during grinding and polishing. Classified HTS 8482.10.5068 for other ball bearings suited to nanoscale tolerances in silicon wafer fab. Minimizes particulate generation critical for cleanroom standards.