Thin-Section Ball Bearing for Wafer Polishers from Mexico
Thin-section ball bearings for wafer lappers and polishers, providing ultra-low profile support for surface flatness in semiconductor fabrication prep. Classified in HTS 8482.10.5068 as other ball bearings not fitting prior subcategories, critical for bringing wafers to dimensional tolerances before device processing. Enables the high-precision polishing required for monocrystalline silicon wafers.
Duty Rate — Mexico → United States
34%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Provide cross-sectional diagrams showing thin design to confirm 'other' status
• Document compatibility with CMP (chemical mechanical polishing) processes
• Avoid bulk packaging; use ESD-safe individual wraps for import inspection