Miniature Deep Groove Ball Bearing from Germany
Miniature deep groove ball bearing for wafer slicing saw spindles in semiconductor wafer preparation equipment, offering low friction for ultra-thin kerf cuts. Classified under HTS 8482.10.50 as other ball bearings. Essential for precise slicing of monocrystalline semiconductor boules into wafers.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Document end-use in semiconductor wafer prep to support classification; include equipment blueprints
• Watch for anti-dumping duties on miniature bearings from certain origins
• Pitfall: incorrect size reporting leading to thrust bearing misclassification