Miniature Deep Groove Ball Bearing from China
Miniature deep groove ball bearing for wafer slicing saw spindles in semiconductor wafer preparation equipment, offering low friction for ultra-thin kerf cuts. Classified under HTS 8482.10.50 as other ball bearings. Essential for precise slicing of monocrystalline semiconductor boules into wafers.
Duty Rate — China → United States
46.5%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Document end-use in semiconductor wafer prep to support classification; include equipment blueprints
• Watch for anti-dumping duties on miniature bearings from certain origins
• Pitfall: incorrect size reporting leading to thrust bearing misclassification