Miniature Deep Groove Ball Bearing from Mexico
Miniature deep groove ball bearing for wafer slicing saw spindles in semiconductor wafer preparation equipment, offering low friction for ultra-thin kerf cuts. Classified under HTS 8482.10.50 as other ball bearings. Essential for precise slicing of monocrystalline semiconductor boules into wafers.
Duty Rate — Mexico → United States
19%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document end-use in semiconductor wafer prep to support classification; include equipment blueprints
• Watch for anti-dumping duties on miniature bearings from certain origins
• Pitfall: incorrect size reporting leading to thrust bearing misclassification