Semiconductor Wafer Slicing Saw
Precision inner-diameter saw for slicing ultra-thin wafers from monocrystalline semiconductor boules. Classified under HTS 8479.90.95 as specialized wafer preparation equipment. Features coolant systems and tension control for damage-free slicing.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| π¨π³China | Free | +40.0% | 40% |
| π²π½Mexico | Free | +15.0% | 15% |
| π¨π¦Canada | Free | +15.0% | 15% |
| π©πͺGermany | Free | +15.0% | 15% |
| π―π΅Japan | Free | +15.0% | 15% |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If saw blade tension resembles general sawing machines
Non-semiconductor saws classify under heading 8461 for planing/sawing machines.
If with integrated wafer thickness measuring
Heavy-duty measuring machines in Chapter 90 if primary function is measurement.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right HTS code β and can price the duty on it in the same conversation.
Import Tips & Compliance
β’ Provide wafer thickness specs (typically 100-775ΞΌm) and blade specifications in entry docs
β’ End-use statement must confirm use with silicon/gallium arsenide boules
Related Products under HTS 8479.90.95
Crystal Boule Grinder
Machine that grinds semiconductor crystal boules to precise diameter and adds flats indicating conductivity type and resistivity. Meets HTS 8479.90.95 as wafer preparation equipment per statistical note. Essential step before wafer slicing in semiconductor production.
Double-Sided Wafer Polisher
Machine simultaneously polishing both sides of semiconductor wafers to mirror finish using chemical-mechanical planarization (CMP). HTS 8479.90.95 for wafer preparation polishers in statistical note. Achieves nanometer-level surface flatness.
Silicon Ingot Grinder
Precision grinder for shaping silicon ingots to exact diameter prior to wafer slicing in semiconductor production. Classified HTS 8479.90.95 as crystal grinder per statistical note. Handles 200mm-450mm diameter ingots.
Wafer Edge Profiling Machine
Equipment that profiles wafer edges to prevent chipping and contamination during handling. HTS 8479.90.95 as specialized wafer preparation apparatus. Applies rounded bevels meeting SEMI standards.
Crystal boule Annealing Furnace
High-temperature furnace for annealing semiconductor boules to relieve stresses post-growth. Classified under HTS 8479.90.95 as semiconductor processing equipment. Provides controlled cooling rates to prevent defects.
Wafer Cleaning Centrifuge
High-speed centrifuge removing contaminants from semiconductor wafers post-polishing via centrifugal force. HTS 8479.90.95 for wafer preparation equipment. Handles 25-50 wafers per cycle.