Of machines or mechanical appliances for treating metal
Machines and mechanical appliances having individual functions, not specified or included elsewhere in this chapter; parts thereof: > Parts: > Other > Other: > Of machines or mechanical appliances for treating metal
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8479.90.95.65
Czochralski Crystal Puller Spindle Assembly
This precision-engineered spindle assembly is a critical part of Czochralski crystal pullers used to grow monocrystalline silicon boules for semiconductor wafers. It falls under HTS 8479.90.95.65 as a part of machines for treating metal, specifically semiconductor manufacturing equipment that processes high-purity metal like silicon.
Float Zone Crystal Grower RF Coil Housing
The RF coil housing is an essential component of float zone crystal growers that melt and purify silicon rods to produce semiconductor-grade crystals. Classified under HTS 8479.90.95.65 as parts of metal treating machines for semiconductor material processing.
Wafer Slicing Saw Spindle Bearing Assembly
High-precision bearing assembly for inner diamond wire spindles in wafer slicing saws that cut semiconductor boules into thin wafers. Falls under HTS 8479.90.95.65 as parts of machines mechanically treating silicon crystal ingots.
Crystal Boule Grinder Diamond Wheel Arbor
The diamond wheel arbor holds grinding wheels that shape semiconductor crystal boules to precise wafer diameters. Classified in HTS 8479.90.95.65 as parts of metal treating grinders for semiconductor preparation.
Wafer Lapping Machine Platen Assembly
Precision platen assembly for wafer lapping machines that achieve critical flatness tolerances on semiconductor wafers before polishing. HTS 8479.90.95.65 covers these parts of metal surface treating apparatus.
Semiconductor Wafer Polishing Head Carrier Ring
Carrier ring for chemical mechanical polishing (CMP) heads that hold wafers during final surface preparation for device fabrication. Classified under HTS 8479.90.95.65 as parts of wafer polishing machines treating semiconductor metal surfaces.
Silicon Ingot Crystal Grinder Workhead
Complete workhead assembly for silicon ingot grinders that create reference flats indicating crystal orientation and doping levels. HTS 8479.90.95.65 applies to these precision metal treating machine parts.
Diamond Wire Wafer Saw Tensioning Mechanism
Precision tensioning system for maintaining constant wire tension during high-speed wafer slicing from silicon boules. Classified in HTS 8479.90.95.65 as parts of semiconductor wafer manufacturing saws.
Wafer Edge Grinder Collet Chuck
Vacuum collet chuck for holding wafers during edge grinding to remove micro-cracks and achieve chip strength specifications. HTS 8479.90.95.65 for parts of semiconductor wafer preparation grinders.
Crystal Puller Crucible Rotation Drive Unit
Drive mechanism that rotates the quartz crucible during Czochralski silicon growth to ensure crystal quality uniformity. Parts of metal treating/melting machines under HTS 8479.90.95.65.
Wafer Grinder Air Bearing Spindle
Air bearing spindle providing frictionless rotation for wafer back grinding to ultra-thin specifications (<50 microns). HTS 8479.90.95.65 parts for semiconductor surface grinding machines.
Float Zone Seed Holder Chuck
Precision chuck holding polycrystalline seed at exact melting interface during float zone silicon purification. Classified under HTS 8479.90.95.65 for parts of zone refining metal treating apparatus.
Wafer Polisher Slurry Distribution Ring
Slurry distribution ring ensuring uniform chemical delivery across wafer surface during CMP polishing operations. HTS 8479.90.95.65 for semiconductor polishing machine parts.
Boule Slicing Saw Coolant Manifold
High-pressure coolant manifold delivering coolant to diamond wire during silicon boule slicing operations. Parts of wafer manufacturing saws under HTS 8479.90.95.65.
Wafer Lapper Conditioning Ring
Diamond pellet conditioning ring maintaining lapping plate flatness during semiconductor wafer preparation. HTS 8479.90.95.65 parts for metal surface treating lapping machines.