Czochralski Crystal Puller Spindle Assembly
This precision-engineered spindle assembly is a critical part of Czochralski crystal pullers used to grow monocrystalline silicon boules for semiconductor wafers. It falls under HTS 8479.90.95.65 as a part of machines for treating metal, specifically semiconductor manufacturing equipment that processes high-purity metal like silicon.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If classified as a general flywheel or pulley
Parts like spindles may fall under 8483 if not specifically identified for semiconductor equipment.
If primarily for machine testing functions
Testing apparatus parts for semiconductor machines are classified in Chapter 90.
If for non-metal treating semiconductor machines
Other semiconductor processing machines have different part provisions.
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Import Tips & Compliance
• Verify the part is specifically for semiconductor crystal growers and provide manufacturer specs linking to Czochralski process
• Include detailed technical drawings showing compatibility with wafer manufacturing equipment to avoid misclassification
• Ensure documentation proves the machine's primary function is treating semiconductor metals like silicon
Related Products under HTS 8479.90.95.65
Float Zone Crystal Grower RF Coil Housing
The RF coil housing is an essential component of float zone crystal growers that melt and purify silicon rods to produce semiconductor-grade crystals. Classified under HTS 8479.90.95.65 as parts of metal treating machines for semiconductor material processing.
Wafer Slicing Saw Spindle Bearing Assembly
High-precision bearing assembly for inner diamond wire spindles in wafer slicing saws that cut semiconductor boules into thin wafers. Falls under HTS 8479.90.95.65 as parts of machines mechanically treating silicon crystal ingots.
Crystal Boule Grinder Diamond Wheel Arbor
The diamond wheel arbor holds grinding wheels that shape semiconductor crystal boules to precise wafer diameters. Classified in HTS 8479.90.95.65 as parts of metal treating grinders for semiconductor preparation.
Wafer Lapping Machine Platen Assembly
Precision platen assembly for wafer lapping machines that achieve critical flatness tolerances on semiconductor wafers before polishing. HTS 8479.90.95.65 covers these parts of metal surface treating apparatus.
Semiconductor Wafer Polishing Head Carrier Ring
Carrier ring for chemical mechanical polishing (CMP) heads that hold wafers during final surface preparation for device fabrication. Classified under HTS 8479.90.95.65 as parts of wafer polishing machines treating semiconductor metal surfaces.
Silicon Ingot Crystal Grinder Workhead
Complete workhead assembly for silicon ingot grinders that create reference flats indicating crystal orientation and doping levels. HTS 8479.90.95.65 applies to these precision metal treating machine parts.