Wafer Grinder Air Bearing Spindle
Air bearing spindle providing frictionless rotation for wafer back grinding to ultra-thin specifications (<50 microns). HTS 8479.90.95.65 parts for semiconductor surface grinding machines.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If for complete grinding machines vs parts
Complete machines have different tariff provisions.
If air bearing treated as turbomachinery
Some air bearings classified with fans/blowers.
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Import Tips & Compliance
• Provide air flow and pressure specifications for bearing performance
• Include runout specifications (<0.1 microns at 2000 RPM)
• Clean thoroughly before packaging to prevent contamination
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