8479.90.95.65/Wafer Grinder Air Bearing Spindle/Japan

Wafer Grinder Air Bearing Spindle from Japan

Air bearing spindle providing frictionless rotation for wafer back grinding to ultra-thin specifications (<50 microns). HTS 8479.90.95.65 parts for semiconductor surface grinding machines.

Duty Rate — Japan → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Provide air flow and pressure specifications for bearing performance

• Include runout specifications (<0.1 microns at 2000 RPM)

• Clean thoroughly before packaging to prevent contamination

Wafer Grinder Air Bearing Spindle from Japan — Import Duty Rate | HTS 8479.90.95.65