Wafer Grinder Air Bearing Spindle from Germany
Air bearing spindle providing frictionless rotation for wafer back grinding to ultra-thin specifications (<50 microns). HTS 8479.90.95.65 parts for semiconductor surface grinding machines.
Duty Rate — Germany → United States
15%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.05.900%Articles of aluminum, of steel or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; patented pharmaceutical articles; and semiconductor articles, as provided in subdivision (f) of U.S. note 52 to this subchapter
Import Tips
• Provide air flow and pressure specifications for bearing performance
• Include runout specifications (<0.1 microns at 2000 RPM)
• Clean thoroughly before packaging to prevent contamination