Boule Slicing Saw Coolant Manifold
High-pressure coolant manifold delivering coolant to diamond wire during silicon boule slicing operations. Parts of wafer manufacturing saws under HTS 8479.90.95.65.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If general heat exchange manifolds
Cooling equipment parts without semiconductor link.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Test for leak-free operation at 10+ bar pressures
• Specify nozzle orifice sizes for laminar flow patterns
• Include filtration compatibility for diamond slurry removal
Related Products under HTS 8479.90.95.65
Czochralski Crystal Puller Spindle Assembly
This precision-engineered spindle assembly is a critical part of Czochralski crystal pullers used to grow monocrystalline silicon boules for semiconductor wafers. It falls under HTS 8479.90.95.65 as a part of machines for treating metal, specifically semiconductor manufacturing equipment that processes high-purity metal like silicon.
Float Zone Crystal Grower RF Coil Housing
The RF coil housing is an essential component of float zone crystal growers that melt and purify silicon rods to produce semiconductor-grade crystals. Classified under HTS 8479.90.95.65 as parts of metal treating machines for semiconductor material processing.
Wafer Slicing Saw Spindle Bearing Assembly
High-precision bearing assembly for inner diamond wire spindles in wafer slicing saws that cut semiconductor boules into thin wafers. Falls under HTS 8479.90.95.65 as parts of machines mechanically treating silicon crystal ingots.
Crystal Boule Grinder Diamond Wheel Arbor
The diamond wheel arbor holds grinding wheels that shape semiconductor crystal boules to precise wafer diameters. Classified in HTS 8479.90.95.65 as parts of metal treating grinders for semiconductor preparation.
Wafer Lapping Machine Platen Assembly
Precision platen assembly for wafer lapping machines that achieve critical flatness tolerances on semiconductor wafers before polishing. HTS 8479.90.95.65 covers these parts of metal surface treating apparatus.
Semiconductor Wafer Polishing Head Carrier Ring
Carrier ring for chemical mechanical polishing (CMP) heads that hold wafers during final surface preparation for device fabrication. Classified under HTS 8479.90.95.65 as parts of wafer polishing machines treating semiconductor metal surfaces.