Wafer Edge Profiling Machine
Equipment that profiles wafer edges to prevent chipping and contamination during handling. HTS 8479.90.95 as specialized wafer preparation apparatus. Applies rounded bevels meeting SEMI standards.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| π¨π³China | Free | +35.0% | 35% |
| π²π½Mexico | Free | +10.0% | 10% |
| π¨π¦Canada | Free | +10.0% | 10% |
| π©πͺGermany | Free | +10.0% | 10% |
| π―π΅Japan | Free | +10.0% | 10% |
More Specific Codes
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If general edge grinding machines
Non-semiconductor edge grinders fall under machine tool headings.
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Import Tips & Compliance
β’ Reference SEMI M1 standards for edge geometry in technical specs
β’ Document vacuum chuck design for thin wafer handling (<100ΞΌm)
β’ Common misclassification as general edge grinder under 8460
Related Products under HTS 8479.90.95
Crystal Boule Grinder
Machine that grinds semiconductor crystal boules to precise diameter and adds flats indicating conductivity type and resistivity. Meets HTS 8479.90.95 as wafer preparation equipment per statistical note. Essential step before wafer slicing in semiconductor production.
Double-Sided Wafer Polisher
Machine simultaneously polishing both sides of semiconductor wafers to mirror finish using chemical-mechanical planarization (CMP). HTS 8479.90.95 for wafer preparation polishers in statistical note. Achieves nanometer-level surface flatness.
Silicon Ingot Grinder
Precision grinder for shaping silicon ingots to exact diameter prior to wafer slicing in semiconductor production. Classified HTS 8479.90.95 as crystal grinder per statistical note. Handles 200mm-450mm diameter ingots.
Crystal boule Annealing Furnace
High-temperature furnace for annealing semiconductor boules to relieve stresses post-growth. Classified under HTS 8479.90.95 as semiconductor processing equipment. Provides controlled cooling rates to prevent defects.
Wafer Cleaning Centrifuge
High-speed centrifuge removing contaminants from semiconductor wafers post-polishing via centrifugal force. HTS 8479.90.95 for wafer preparation equipment. Handles 25-50 wafers per cycle.
Czochralski Crystal Puller
A machine used to produce monocrystalline silicon boules by the Czochralski method for semiconductor wafer manufacturing. It falls under HTS 8479.90.95 as a specialized semiconductor manufacturing machine not specified elsewhere in Chapter 84. This equipment is critical for growing high-purity crystals from which wafers are sliced.