8479.90.95/Wafer Edge Profiling Machine/Japan

Wafer Edge Profiling Machine from Japan

Equipment that profiles wafer edges to prevent chipping and contamination during handling. HTS 8479.90.95 as specialized wafer preparation apparatus. Applies rounded bevels meeting SEMI standards.

Duty Rate — Japan → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Reference SEMI M1 standards for edge geometry in technical specs

• Document vacuum chuck design for thin wafer handling (<100μm)

• Common misclassification as general edge grinder under 8460

Wafer Edge Profiling Machine from Japan — Import Duty Rate | HTS 8479.90.95