Other
Machines and mechanical appliances having individual functions, not specified or included elsewhere in this chapter; parts thereof: > Parts: > Other > Other: > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8479.90.95.96
Float Zone Crystal Grower
Float zone crystal growers employ the float zone method to produce high-purity monocrystalline semiconductor boules by zone melting without a crucible. Classified under HTS 8479.90.95.96 as semiconductor wafer manufacturing equipment part for crystal growth processes.
Semiconductor Wafer Lapper
Wafer lappers use loose abrasive slurries to lap both sides of semiconductor wafers simultaneously, achieving critical flatness for device fabrication. HTS 8479.90.95.96 covers this wafer preparation equipment essential for semiconductor processing.
Silicon Ingot Grinder
Precision silicon ingot grinders shape cylindrical semiconductor boules to uniform diameter with orientation notches for wafer slicing alignment. HTS 8479.90.95.96 includes this wafer manufacturing preparation equipment.
Gallium Arsenide Wafer Slicer
Specialized wafer slicers for brittle gallium arsenide compound semiconductor boules, featuring inner-diameter diamond saws with tension control. Falls under HTS 8479.90.95.96 for compound semiconductor wafer preparation.
Crystal boule Orientation Grinder
Orientation grinders create precise flats on semiconductor boules to indicate crystal plane, doping type, and resistivity for wafer fabrication traceability. Classified under HTS 8479.90.95.96 as essential wafer prep equipment.
Precision Wafer Edge Grinder
Wafer edge grinders chamfer and profile semiconductor wafer edges to prevent chipping during handling and processing. HTS 8479.90.95.96 covers this critical wafer preparation for fabrication yield improvement.
Czochralski Crystal Puller
A Czochralski crystal puller is used to produce extremely pure monocrystalline semiconductor boules from silicon or gallium arsenide melts, from which wafers are sliced. It falls under HTS 8479.90.95.96 as a part of semiconductor manufacturing equipment for crystal growth, classified as other machines and mechanical appliances having individual functions not specified elsewhere.
Crystal Boule Grinder
Crystal boule grinders precisely grind semiconductor crystal ingots to exact diameters and create orientation flats indicating conductivity type and resistivity. Falls under HTS 8479.90.95.96 as wafer preparation equipment for semiconductor processing.
Wafer Slicing Diamond Saw
Wafer slicing saws with diamond blades cut ultra-thin semiconductor wafers from monocrystalline boules while maintaining crystal orientation. Classified under HTS 8479.90.95.96 as essential wafer preparation equipment in semiconductor manufacturing.
Double-Sided Wafer Polisher
Double-sided wafer polishers use chemical-mechanical polishing (CMP) to achieve mirror-finish flatness on semiconductor wafers for fabrication processing. Classified under HTS 8479.90.95.96 as critical wafer preparation apparatus.