Wafer Slicing Diamond Saw
Wafer slicing saws with diamond blades cut ultra-thin semiconductor wafers from monocrystalline boules while maintaining crystal orientation. Classified under HTS 8479.90.95.96 as essential wafer preparation equipment in semiconductor manufacturing.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If for sawing semiconductor materials thicker than wafer tolerances
Saws for semiconductor boule sectioning (not final wafers) classified as material working machines.
If diamond saw blades imported separately
Bandsaw blades classified as tools, not complete slicing machines.
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Import Tips & Compliance
• Provide cut thickness specifications (<100 microns typical) and crystal damage minimization features
• Include slurry system documentation showing semiconductor-grade processing capability
Related Products under HTS 8479.90.95.96
Float Zone Crystal Grower
Float zone crystal growers employ the float zone method to produce high-purity monocrystalline semiconductor boules by zone melting without a crucible. Classified under HTS 8479.90.95.96 as semiconductor wafer manufacturing equipment part for crystal growth processes.
Semiconductor Wafer Lapper
Wafer lappers use loose abrasive slurries to lap both sides of semiconductor wafers simultaneously, achieving critical flatness for device fabrication. HTS 8479.90.95.96 covers this wafer preparation equipment essential for semiconductor processing.
Silicon Ingot Grinder
Precision silicon ingot grinders shape cylindrical semiconductor boules to uniform diameter with orientation notches for wafer slicing alignment. HTS 8479.90.95.96 includes this wafer manufacturing preparation equipment.
Gallium Arsenide Wafer Slicer
Specialized wafer slicers for brittle gallium arsenide compound semiconductor boules, featuring inner-diameter diamond saws with tension control. Falls under HTS 8479.90.95.96 for compound semiconductor wafer preparation.
Crystal boule Orientation Grinder
Orientation grinders create precise flats on semiconductor boules to indicate crystal plane, doping type, and resistivity for wafer fabrication traceability. Classified under HTS 8479.90.95.96 as essential wafer prep equipment.
Precision Wafer Edge Grinder
Wafer edge grinders chamfer and profile semiconductor wafer edges to prevent chipping during handling and processing. HTS 8479.90.95.96 covers this critical wafer preparation for fabrication yield improvement.