Wafer Slicing Diamond Saw from Mexico
Wafer slicing saws with diamond blades cut ultra-thin semiconductor wafers from monocrystalline boules while maintaining crystal orientation. Classified under HTS 8479.90.95.96 as essential wafer preparation equipment in semiconductor manufacturing.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Provide cut thickness specifications (<100 microns typical) and crystal damage minimization features
• Include slurry system documentation showing semiconductor-grade processing capability