Silicon Ingot Grinder
Precision silicon ingot grinders shape cylindrical semiconductor boules to uniform diameter with orientation notches for wafer slicing alignment. HTS 8479.90.95.96 includes this wafer manufacturing preparation equipment.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If general cylindrical grinding without semiconductor flats/notches
Standard centerless grinders for metal/ceramic cylinders under Chapter 84.
If imported as grinding wheels only
Interchangeable grinding tools classified separately from machines.
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Import Tips & Compliance
• Specify notch geometry standards (SEMI M1-M13) for semiconductor boule identification
• Provide roundness and diameter tolerance documentation (<2 microns typical)
• Risk of 8460.29 classification without semiconductor-specific notch capabilities
Related Products under HTS 8479.90.95.96
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Gallium Arsenide Wafer Slicer
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Crystal boule Orientation Grinder
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Precision Wafer Edge Grinder
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Czochralski Crystal Puller
A Czochralski crystal puller is used to produce extremely pure monocrystalline semiconductor boules from silicon or gallium arsenide melts, from which wafers are sliced. It falls under HTS 8479.90.95.96 as a part of semiconductor manufacturing equipment for crystal growth, classified as other machines and mechanical appliances having individual functions not specified elsewhere.