Silicon Ingot Grinder from Mexico
Precision silicon ingot grinders shape cylindrical semiconductor boules to uniform diameter with orientation notches for wafer slicing alignment. HTS 8479.90.95.96 includes this wafer manufacturing preparation equipment.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify notch geometry standards (SEMI M1-M13) for semiconductor boule identification
• Provide roundness and diameter tolerance documentation (<2 microns typical)
• Risk of 8460.29 classification without semiconductor-specific notch capabilities