Silicon Ingot Grinder from Japan
Precision silicon ingot grinders shape cylindrical semiconductor boules to uniform diameter with orientation notches for wafer slicing alignment. HTS 8479.90.95.96 includes this wafer manufacturing preparation equipment.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Specify notch geometry standards (SEMI M1-M13) for semiconductor boule identification
• Provide roundness and diameter tolerance documentation (<2 microns typical)
• Risk of 8460.29 classification without semiconductor-specific notch capabilities