Crystal Boule Grinder

Crystal boule grinders precisely grind semiconductor crystal ingots to exact diameters and create orientation flats indicating conductivity type and resistivity. Falls under HTS 8479.90.95.96 as wafer preparation equipment for semiconductor processing.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳ChinaFree+35.0%35%
🇲🇽MexicoFree+10.0%10%
🇨🇦CanadaFree+10.0%10%
🇩🇪GermanyFree+10.0%10%
🇯🇵JapanFree+10.0%10%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8460.40Lower: 14.4% vs 35%

If used for general precision grinding beyond semiconductor flats

General honing or grinding machines without semiconductor-specific flats fall under Chapter 84.

8204Lower: 19% vs 35%

If imported as grinding tool only, without machine base

Interchangeable grinding tools classified separately from complete machines.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

Submit engineering drawings showing flat orientation capabilities critical for semiconductor classification

Document achievable tolerances (typically <1 micron) to distinguish from general grinding machines

Related Products under HTS 8479.90.95.96

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Float zone crystal growers employ the float zone method to produce high-purity monocrystalline semiconductor boules by zone melting without a crucible. Classified under HTS 8479.90.95.96 as semiconductor wafer manufacturing equipment part for crystal growth processes.

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Wafer lappers use loose abrasive slurries to lap both sides of semiconductor wafers simultaneously, achieving critical flatness for device fabrication. HTS 8479.90.95.96 covers this wafer preparation equipment essential for semiconductor processing.

Silicon Ingot Grinder

Precision silicon ingot grinders shape cylindrical semiconductor boules to uniform diameter with orientation notches for wafer slicing alignment. HTS 8479.90.95.96 includes this wafer manufacturing preparation equipment.

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Crystal boule Orientation Grinder

Orientation grinders create precise flats on semiconductor boules to indicate crystal plane, doping type, and resistivity for wafer fabrication traceability. Classified under HTS 8479.90.95.96 as essential wafer prep equipment.

Precision Wafer Edge Grinder

Wafer edge grinders chamfer and profile semiconductor wafer edges to prevent chipping during handling and processing. HTS 8479.90.95.96 covers this critical wafer preparation for fabrication yield improvement.