Wafer Edge Profiling Machine from Mexico
Equipment that profiles wafer edges to prevent chipping and contamination during handling. HTS 8479.90.95 as specialized wafer preparation apparatus. Applies rounded bevels meeting SEMI standards.
Duty Rate — Mexico → United States
15%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Reference SEMI M1 standards for edge geometry in technical specs
• Document vacuum chuck design for thin wafer handling (<100μm)
• Common misclassification as general edge grinder under 8460