Semiconductor Wafer Slicing Saw from Canada
Precision inner-diameter saw for slicing ultra-thin wafers from monocrystalline semiconductor boules. Classified under HTS 8479.90.95 as specialized wafer preparation equipment. Features coolant systems and tension control for damage-free slicing.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Provide wafer thickness specs (typically 100-775μm) and blade specifications in entry docs
• End-use statement must confirm use with silicon/gallium arsenide boules