Semiconductor Wafer Slicing Saw from Canada
Precision inner-diameter saw for slicing ultra-thin wafers from monocrystalline semiconductor boules. Classified under HTS 8479.90.95 as specialized wafer preparation equipment. Features coolant systems and tension control for damage-free slicing.
Duty Rate — Canada → United States
15%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Provide wafer thickness specs (typically 100-775μm) and blade specifications in entry docs
• End-use statement must confirm use with silicon/gallium arsenide boules