Semiconductor Wafer Slicing Saw from Germany
Precision inner-diameter saw for slicing ultra-thin wafers from monocrystalline semiconductor boules. Classified under HTS 8479.90.95 as specialized wafer preparation equipment. Features coolant systems and tension control for damage-free slicing.
Duty Rate — Germany → United States
15%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Provide wafer thickness specs (typically 100-775μm) and blade specifications in entry docs
• End-use statement must confirm use with silicon/gallium arsenide boules