Wafer Grinder Diamond Wheel
Resin or metal-bonded diamond grinding wheel for back-grinding semiconductor wafers to precise thickness post-processing, dedicated to 8472.90.50 grinders. Achieves flatness critical for device fabrication. HTS 8473.40.41.00 applies as specialized semiconductor part.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If non-specific diamond grinding wheels
Agglomerated synthetic diamonds classify here without proof of principal semiconductor use.
If for general precision grinding machines
Parts for machines not of 8472 shift to Chapter 84 grinding tool parts.
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Import Tips & Compliance
• Specify grind wheel RPM rating and wafer size compatibility (200mm/300mm) in import docs
• Use affidavits from manufacturer confirming sole use in semiconductor wafer grinders
Related Products under HTS 8473.40.41.00
Float Zone Crystal Grower RF Coil
Radio frequency induction coil used in float zone furnaces for producing high-purity silicon crystals from polycrystalline rods, specific to 8472.90.50 machines. It generates the molten zone for zone refining without crucibles. Classified in HTS 8473.40.41.00 for semiconductor processing equipment parts.
Wafer Lapping Plate
Cast iron or ceramic lapping plate for simultaneous double-side lapping of semiconductor wafers to achieve total thickness variation (TTV) tolerances, specific to 8472.90.50 lappers. Provides uniform material removal for flatness. HTS 8473.40.41.00 classification.
Crystal Ingot Weighing Sensor Assembly
Load cell assembly integrated into Czochralski pullers (8472.90.50) for real-time monitoring of crystal growth weight and pull rate control. Ensures boule diameter uniformity. Part of HTS 8473.40.41.00 semiconductor equipment.
Czochralski Crystal Puller Heater Element
A graphite or molybdenum heater element designed specifically for Czochralski crystal growers used in semiconductor wafer production, falling under machines of 8472.90.50. It provides precise high-temperature control for pulling monocrystalline silicon boules. Classified as a part of semiconductor manufacturing equipment in HTS 8473.40.41.00.
Semiconductor Wafer Slicing Saw Blade
Diamond-impregnated saw blade engineered for inner-diameter (ID) saws that slice monocrystalline semiconductor boules into thin wafers, exclusive to machines of 8472.90.50. It ensures minimal kerf loss and high precision for silicon wafer preparation. Fits HTS 8473.40.41.00 as a dedicated accessory.
Crystal Boule Grinder Flatting Wheel
Specialized grinding wheel for creating orientation flats on silicon boules to indicate crystal plane and doping type, used in 8472.90.50 crystal grinders. Ensures wafers sliced from boule have correct conductivity markers. Part of HTS 8473.40.41.00.