Wafer Grinder Diamond Wheel from Mexico
Resin or metal-bonded diamond grinding wheel for back-grinding semiconductor wafers to precise thickness post-processing, dedicated to 8472.90.50 grinders. Achieves flatness critical for device fabrication. HTS 8473.40.41.00 applies as specialized semiconductor part.
Duty Rate — Mexico → United States
12%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify grind wheel RPM rating and wafer size compatibility (200mm/300mm) in import docs
• Use affidavits from manufacturer confirming sole use in semiconductor wafer grinders