Wafer Grinder Diamond Wheel from Mexico
Resin or metal-bonded diamond grinding wheel for back-grinding semiconductor wafers to precise thickness post-processing, dedicated to 8472.90.50 grinders. Achieves flatness critical for device fabrication. HTS 8473.40.41.00 applies as specialized semiconductor part.
Duty Rate — Mexico → United States
12%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Specify grind wheel RPM rating and wafer size compatibility (200mm/300mm) in import docs
• Use affidavits from manufacturer confirming sole use in semiconductor wafer grinders