Other parts and accessories of the machines of 8472.90.50
Parts and accessories (other than covers, carrying cases and the like) suitable for use solely or principally with machines of headings 8470 to 8472: > Parts and accessories of the machines of heading 8472: > Other parts and accessories of the machines of 8472.90.50
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Products classified under HTS 8473.40.41.00
Float Zone Crystal Grower RF Coil
Radio frequency induction coil used in float zone furnaces for producing high-purity silicon crystals from polycrystalline rods, specific to 8472.90.50 machines. It generates the molten zone for zone refining without crucibles. Classified in HTS 8473.40.41.00 for semiconductor processing equipment parts.
Wafer Lapping Plate
Cast iron or ceramic lapping plate for simultaneous double-side lapping of semiconductor wafers to achieve total thickness variation (TTV) tolerances, specific to 8472.90.50 lappers. Provides uniform material removal for flatness. HTS 8473.40.41.00 classification.
Crystal Ingot Weighing Sensor Assembly
Load cell assembly integrated into Czochralski pullers (8472.90.50) for real-time monitoring of crystal growth weight and pull rate control. Ensures boule diameter uniformity. Part of HTS 8473.40.41.00 semiconductor equipment.
Czochralski Crystal Puller Heater Element
A graphite or molybdenum heater element designed specifically for Czochralski crystal growers used in semiconductor wafer production, falling under machines of 8472.90.50. It provides precise high-temperature control for pulling monocrystalline silicon boules. Classified as a part of semiconductor manufacturing equipment in HTS 8473.40.41.00.
Semiconductor Wafer Slicing Saw Blade
Diamond-impregnated saw blade engineered for inner-diameter (ID) saws that slice monocrystalline semiconductor boules into thin wafers, exclusive to machines of 8472.90.50. It ensures minimal kerf loss and high precision for silicon wafer preparation. Fits HTS 8473.40.41.00 as a dedicated accessory.
Wafer Grinder Diamond Wheel
Resin or metal-bonded diamond grinding wheel for back-grinding semiconductor wafers to precise thickness post-processing, dedicated to 8472.90.50 grinders. Achieves flatness critical for device fabrication. HTS 8473.40.41.00 applies as specialized semiconductor part.
Crystal Boule Grinder Flatting Wheel
Specialized grinding wheel for creating orientation flats on silicon boules to indicate crystal plane and doping type, used in 8472.90.50 crystal grinders. Ensures wafers sliced from boule have correct conductivity markers. Part of HTS 8473.40.41.00.
CMP Wafer Polishing Pad Conditioner
Diamond disk conditioner for dressing chemical mechanical polishing (CMP) pads used in 8472.90.50 polishers during semiconductor wafer fabrication. Maintains pad surface asperity for uniform material removal. Fits as accessory in HTS 8473.40.41.00.
Semiconductor Wafer Handling Chuck
Vacuum or electrostatic chuck for precise wafer holding during grinding, lapping, and polishing in 8472.90.50 machines. Features porous ceramic surface for uniform vacuum distribution. HTS 8473.40.41.00 for semiconductor-specific parts.
Wafer Edge Profiling Tool
Precision grinding tool for wafer edge profiling to SEMI standards, preventing chipping during handling in 8472.90.50 preparation equipment. Creates rounded/chamfered edges. HTS 8473.40.41.00 accessory.